San Francisco, Sep 10 : Intel has kicked off work on the construction of a new $20 billion semiconductor facility in the Ohio state in US in which the president Joe Biden joined the chip-maker and Ohio Governor Mike DeWine to celebrate breaking ground in the “Silicon Heartland” on the world’s most advanced chip manufacturing facilities.The plant for chip production is part of Intel’s plan to invest $100 billion in Ohio over the next 10 years.
“Today is a significant day in the process of building an increasingly robust and geographically balanced semiconductor supply chain” stated Pat Gelsinger, Intel CEO.
“The creation of the Silicon Heartland is testament to the power of government incentives to stimulate private investment and create thousands of high-paying jobs and enhance U.S.economic and national security,” he said in an announcement.
During the first phase, Intel is providing $17.7 million for eight proposals from leading institutions and collaborators in Ohio to develop semiconductor-focused education and workforce programmes.
The semiconductor manufacturing facility will create 7,000 construction positions and 3,000 long-term jobs in engineering and manufacturing.
The plant, valued at $20 billion, is one of the first manufacturing facilities for chips following the recent passage of the CHIPS and Science Act.
Intel had previously delayed the plant’s opening ceremony due to the fact that its plans depended “on financing via the CHIPS Act.
Biden has signed the $280 billion technology and science bill last month, describing it as “a once in an era investment in America itself.”
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